Each DSP Data Sheet contains information on the packages ability to operate and dissipate heat. This parameter is said to be the devices Thermal Resistance. Thermal resistance is measured in degrees Centigrade per Watt ( C/W ). Two parameters define the package thermal characteristics, Junction to Case Temperature ( ΘJc ) and Junction to Air Temperature ( ΘJa ).
Airflow can also affect the packages ability to dissipate heat. With greater airflow, the junction to air of the package lowers as airflow increases. Therefore, the more airflow, the more heat the device can dissipate.